日立高科将上市可提高电磁波吸收性能和散热性能的材料。金属的导热性能高,而软磁性金属的电磁波吸收性能高。此次,通过在直径平均约20μm的软磁性金属的粒子表面覆盖二氧化硅(SiO2)材料,实现了1013Ωcm的绝缘性。该材料可搀杂到手机和汽车的半导体封装树脂材料中以及融合到手机和显示器等用于电磁波吸收散热薄膜中。通过覆盖SiO2,提高了树脂的浸湿性,因此也容易搀杂到树脂材料中。
  导热率方面,与掺杂SiO2的普通半导体封装材料相比,大约为后者的3倍。电磁波吸收性能方面,与用于显示器的普通电磁波吸收薄膜相比,也大约为后者的3倍。

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                         来源:日经BP社