Sonoscan近日宣布其SonoLab部门推出一项新的服务，提供增强性声成像堆叠芯片封装显微图像。该服务采用Sonoscan近两年开发的专利软件，该软件可获得芯片堆叠图像，对于内部缺陷分析来说具有前所未有的精确度。

Effective Acoustic Microscope Imaging of Stacked Die

Elk Grove Village, IL July 21, 2009 — Sonoscan Inc., has announced that its SonoLab division is offering a new service that provides greatly enhanced acoustic microscope imaging of stacked die assemblies.

The new service, available immediately, uses Sonoscan’s proprietary software developed over the last two (2) years. The new software images die stacks with unprecedented accuracy for internal defect analysis.

Most significantly, it can assign a defect or other feature to a specific layer within the stack, a capability that had been limited due to the thinness and number of layers, until now!

“The merging of the new software with Sonoscan’s C-SAM hardware means that we can now effectively and consistently image the multiple layers in stacked die configurations,” said SonoLab Manager Ray Thomas. “In the hands of our experienced applications engineers, this software provides accurate and reliable analyses of stacked die.”

“IC designers, IC packaging engineers, semiconductor failure analysis labs, and semiconductor manufacturing engineers are among those who will benefit from this new analytical service,” he added.